- SEC Model 865 Eagle: Precision flip-chip bonder capable of thermocompression, thermosonic, or reflow (solder-bump) flip-chip bonding.
- Disco Model DAD3220: Semiconductor Dicing Saw. Fully programmable, small footprint automatic wafer dicing tool. Maximum wafer size is 150 mm diameter (6”).
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Populate the side area with widgets, images, and more. Easily add social icons linking to your social media pages and make sure that they are always just one click away.
